| ABSTRACT. High-performance computing (HPC) applications are increasingly powering our lives and work. This means that the demand for even more processing capability is on the rise. Traditional approaches to meet this imperative include increasing die sizes and/or shrinking logic circuits. These approaches, however, have their limits. Today, Moore’s Law, which dictates that the number of transistors in a dense integrated circuit
will double every two years, is slowing down just as the demand for more powerful processers is surging. The future of computing therefore relies on advanced packaging innovations that will enable the continued scaling of processor performance to meet the intense computing demands of HPC applications. AMD is answering the challenge with its new 3D chiplet technology. |
