OCZ Technology Group ha ampliato la sua gamma di memorie RAM DDR3 ad alte prestazioni ed affidabilità Intel Extreme Memory con l'aggiunta di nuove soluzioni concepite ed ottimizzate per l'installazione in presenza delle motherboard basate sui chipset X38 e X48 di Intel.

Tutti i moduli sono dotati del sistema di dissipazione proprietario XTC e della tecnologia Intel Extreme Memory Profiles (XMP), che semplifica il tweaking della memoria centrale mediante il ricorso a profili di ottimizzazione predefiniti.

Segue l'elenco completo dei nuovi kit presentati da OCZ, con il dettaglio sulla frequenza operativa (1333MHz oppure 1600MHz) e i timing (CL7-7-7).

• PC3-10666 / DDR3-1333 CL7-7-7 4GB (2x2GB) Dual Channel Kit
• PC3-10666 / DDR3-1333 CL7-7-7 2GB (2x1GB) Dual Channel Kit
• PC3-12800 / DDR3-1600 CL7-7-7 4GB (2x2GB) Dual Channel Kit
• PC3-12800 / DDR3-1600 CL7-7-7 2GB (2x1GB) Dual Channel Kit

Sunnyvale, Calif.—July 2, 2008—OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the expansion of its Intel Extreme Memory modules lineup, the latest memory solution that implements a high-performance specification optimized and predefined for the Intel X38 and X48 chipsets. The new modules are rated at DDR3-1333 and DDR3-1600 and feature the all-new Intel branded black XTC heatspreader. With a long history of providing the most innovative products to the enthusiast community, OCZ is excited to take advantage of Intel’s interest and development of overclocking platforms with these latest additions to the series.

Designed to significantly increase performance levels of the entire platform, these modules feature Intel Extreme Memory Profiles (XMP), a proprietary extension of SPD (Serial Presence Detect) settings that act as an integrated "plug and play" overclocking tool. The new Extreme Memory Profile options on the new OCZ DDR3 modules allow the end user to select extreme or ultimate performance through a framework of predefined and validated optimizations of individual settings without the hassle of manually adjusting each parameter, so the timings, voltage, and speed boot automatically for maximum performance.

"We are proud to embrace Intel’s XMP specifications in the new line-up of DDR3 modules," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "XMP-Ready memory allows safe booting of the system under any circumstances while maintaining the built-in overclocking features to bring out the ultimate performance of the entire system."

Configured to Intel’s defined specification, the latest XMP-Ready memory will be available as:

•PC3-10666 / DDR3-1333 CL7-7-7 4GB (2x2GB) Dual Channel Kit
•PC3-10666 / DDR3-1333 CL7-7-7 2GB (2x1GB) Dual Channel Kit
•PC3-12800 / DDR3-1600 CL7-7-7 4GB (2x2GB) Dual Channel Kit
•PC3-12800 / DDR3-1600 CL7-7-7 2GB (2x1GB) Dual Channel Kit

Each kit is configured to run aggressive latencies and features a second enthusiast profile to enable the modules to run at an even more aggressive balance of speed and timings. Each OCZ XMP memory module is backed by the industry-leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.

For more information on the PC3-12800 Intel Extreme Series, please visit our product page here.

For more information on the PC3-10666 Intel Extreme Series, please visit our product page here.